次世代基板実装を支える検査技術 高密度実装基板外観検査の動向
Trends of Optical Inspection for High-Density PWBA

Yasunori Toyoshima
2011 Journal of The Japan Institute of Electronics Packaging  
doi:10.5104/jiep.14.90 fatcat:fe2pmhysmnaldec7jxn4txvi34