Excessive heating of electronic equipments may cause both decreasing thermal performance of system and undesirable consequences such as increased thermal stresses and mechanical defects in the system. In the literature, there are many studies including applications of thermal analysis and technologies in order to make cooling more effective. In this study, flow and heat transfer were investigated numerically in the case of three dimensional, incompressible, fully developed and laminar flow for

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... emi spheres placed as multiple serials in a channel. The continuity, Navier-Stokes and energy equations were solved numerically by using Ansys Fluent-17.0 software program. Air was taken as working fluid. Inlet temperature of the air and sphere surface temperatures were 300 K and 350 K, respectively. The effects of location of semi spheres as multiple serials, placement angle and positions of sphres according to each other on the pressure drop and heat transfer enhancement for case of different Re numbers (Re=100, 200, 400 ve 800) were researched. The obtained results showed that the positions of spheres had a great importance in the case of placement as multiple serials of semi spheres.