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The effect of electromigration (EM) on the interfacial reaction in the Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joint is investigated under a current density of 1.0 × 10 4 A/cm 2 at 150 • C. The (Cu,Ni)6Sn5 intermetallic compounds (IMCs) form at both solder/Ni and solder/Ni-P interfaces in the as-reflowed state. During aging at 150 • C, the (Cu,Ni)6Sn5 interfacial IMCs grow thicker and transform into (Ni,Cu)3Sn4 type after 200 h at solder/Ni interface and 600 h at solder/Ni-P interface,doi:10.7498/aps.61.198104 fatcat:6bfnvr2dovajlc7nutzc4ke3em