UNION: A Unified Inter/Intrachip Optical Network for Chip Multiprocessors

Xiaowen Wu, Yaoyao Ye, Jiang Xu, Wei Zhang, Weichen Liu, Mahdi Nikdast, Xuan Wang
2014 IEEE Transactions on Very Large Scale Integration (vlsi) Systems  
As modern computing systems become increasingly complex, communication efficiency among and inside chips has become as important as the computation speeds of individual processing cores. Traditionally, to maximize design flexibility, interchip and intrachip communication architectures are separately designed under different constraints. Jointly designing communication architectures for both interchip and intrachip communication could, however, potentially yield better solutions. In this paper,
more » ... e present a unified inter/intrachip optical network, called UNION, for chip multiprocessors (CMPs). UNION is based on recent progresses in nanophotonic technologies. It connects not only cores on a single CMP, but also multiple CMPs in a system. UNION employs a hierarchical optical network to separate interchip communication traffic from intrachip communication traffic. It fully utilizes a single optical network to transmit both payload and control packets. The network controller on each CMP not only manages intrachip communications, but also collaborates with each other to facilitate interchip communications. We compared UNION with a matched electrical counterpart in 45-nm process. Simulation results for eight real CMP applications show that on average UNION improves CMP performance by 3× while reducing 88% of network energy consumption. Index Terms-Chip multiprocessor (CMP), interchip optical network, optical NoC, photonic interconnects.
doi:10.1109/tvlsi.2013.2263397 fatcat:muktjmzhafdc5e7jok4lud3ply