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Development and integration of applique decoupling capacitors
ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics
For high-speed integrated circuit applications, it is important to interconnect decoupling capacitors and integrated circuits (ICs) as intimately as possible, to minimize parastic impedances. This can be achieved by mounting freestanding, thin film capacitors directly onto ICs as part of a chip-scale packaging approach. These "appliquk" capacitors utilize a chemically-prepared PLZT dielectric, which is nominally 1 pm thick The small size and weight of applique capacitors can be used to improve
doi:10.1109/isaf.1996.602775
fatcat:ieo2ucbc7jhd3gh7hvmcs276b4