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2011 16th International Solid-State Sensors, Actuators and Microsystems Conference
In this paper we study the impact of the three-dimensional geometry of a micro/nanostructured silicon surface on its reflectivity under incident electromagnetic (EM) illumination. We simulate the optical reflectance of 3D micro/nano silicon cones of different dimensions. Based on the favorable simulation results, maskless textured silicon, called "black silicon" is processed by deep reactive ion etching (DRIE) under cryogenic temperatures. By varying the process parameters, we fabricate conicaldoi:10.1109/transducers.2011.5969470 fatcat:musutidmsvanrcunx5lmid4ylm