The changing landscape of wireless device testing: Compliance and performance

Doug Kramer
2012 IEEE Electromagnetic Compatibility Magazine  
D evices are adding wireless components every day, as they proliferate and the needs for "more and faster" drive wireless technology further, the way that we access and view information will continue to be a rapidly changing landscape. The way that we test and evaluate these converged technology devices is complex and changing too. What was an industry practice or "state-of-the-art" measurement method five years ago may not be suitable for the modern portable wireless broadband device.
more » ... tion channels using greater bandwidth and allowing for higher data rates present more challenges to those making the measurements needed for the evaluation of those devices. Also changing, along with what and how we test, is why we test. One test is worth a thousand expert opinions and in this magazine two industry experts have provided articles on the evolution of the testing landscape. The functionality of many devices is now often merged into a single package; this presents a variety of challenges in how to test and evaluate. Greg Kiemel's paper on "Wireless Trends and Compliance Considerations" briefly reviews the history of wireless testing and presents some important details on approaching testing and compliance with modern devices. Charter This IEEE EMC Society committee is concerned with the design, analysis, modeling and measurement for interference control and mitigation in emerging wireless products. The committee encourages discussion and research on the following, but not limited to, topic areas: • EMC-based system architecture design and system planning • Strategic EMC performance budgeting and distribution • New system interface requirements and new system integration methods • Intra-system coupling path analysis, modeling and validation • New EMC evaluation/measurement methods and standards for components/devices • Innovative component designs with integrated EMC functionalities • New EMC material requirements, applications and evaluation methods • Interdisciplinary issues involving EMC, audio, mechanical, and thermal designs. Interested in joining? If you are an IEEE EMC Society member and would like to join this special committee, please contact one of the SC 4 co-chairs as below with your name and IEEE membership number. The committee primarily will communicate electronically and using teleconferencing. It will also meet face-to-face as needed and at the annual IEEE EMC Symposium. Have ideas? If you are not an IEEE member but have a comment or suggestion, we would like to hear from you.
doi:10.1109/memc.2012.6397085 fatcat:mkcpdlzpcjhg5kuh7e2o3eq76m