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J2240406 Grain size effect on the distribution of local adhesion strength in copper interconnects structure
J2240406 銅配線構造の局所強度分布に対する結晶粒寸法の効果([J224-04]『マイクロ・ナノ機械の信頼性』のための材料創製・測定・解析技術 金属および酸化物の強度と破壊)
2014
The Proceedings of Mechanical Engineering Congress Japan
J2240406 銅配線構造の局所強度分布に対する結晶粒寸法の効果([J224-04]『マイクロ・ナノ機械の信頼性』のための材料創製・測定・解析技術 金属および酸化物の強度と破壊)
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