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Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes
2006
Journal of Applied Physics
The microstructural evolution occurring within the eutectic SnPb solder during electromigration is investigated utilizing Blech specimens. Solder stripes of about 3 m in thickness were fabricated on Cu/ Ti metallization. It was found that the Pb-rich phase ripened and aligned along the direction of the electron flow following the current stressing of 9.7ϫ 10 3 A/cm 2 at 80°C for 24 h. As the stressing time or current density increased, the redistribution of the Pb-rich phase became more
doi:10.1063/1.2178392
fatcat:rpdbddfiz5dofigvvrd7oz3pki