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Study of local stress induced by circuit operation heating in 3D IC
A three-dimensional stacked IC (3D IC) shows considerable promise as method to enhance the performance of IC. A 3D IC consists of several materials such as Si substrate, metal of through Si via (TSV), metal microbump, organic adhesive, and so on. These elements, especially metal microbumps and organic adhesives generate coefficient of thermal expansion (CTE) mismatch. On the other hands, circuits generate heat in Si substrate during operation. Both the CTE mismatch and heat generation inducedoi:10.11486/mes.25.0_355 fatcat:lor6u3xqvbc2dlcfyx7jdz5lli