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An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging
Several design parameters affect the reliability of wafer-level type advanced packaging, such as upper and lower pad sizes, solder volume, buffer layer thickness, and chip thickness, etc. Conventionally, the accelerated thermal cycling test (ATCT) is used to evaluate the reliability life of electronic packaging; however, optimizing the design parameters through ATCT is time-consuming and expensive, reducing the number of experiments becomes a critical issue. In recent years, many researchersdoi:10.3390/ma14185342 pmid:34576571 fatcat:7p72izacmvdq3fedbnpo5cvi6y