Die Attach Process Optimization with Enhanced Epoxy Control on Leadframe Package

Rennier S. Rodriguez, Edwin M. Graycochea Jr, Rammil A. Seguido, Frederick Ray I. Gomez
2020 Journal of Engineering Research and Reports  
The paper presents a practical procedure in selecting the best candidate for die attach epoxy control or anti-epoxy bleed-out (anti-EBO) concentration during the introduction of new leadframe configuration. Three different criteria were implemented to measure the relative impact of the anti-EBO into the different interfaces inside a quad-flat no-leads multi-row (QFN-mr) leadframe unit. Die shear test is performed to measure the shear strength and the compatibility of the anti-EBO to the
more » ... material. EBO measurement is performed herewith to study the propagation of epoxy bleed-out on the surface of the leadframe with reference to the different level of anti-EBO concentration. Package reliability is employed study the response of different interfaces directly in-contact with anti-EBO through thermal-cycling scenario. Ultimately, understanding the effect of anti-EBO into different set of tests provided a systematic way of selecting appropriate leadframe parameters for QFN-mr leadframe product.
doi:10.9734/jerr/2020/v14i217121 fatcat:56ytc3xj4ngbfcfxqpmllhivf4