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The IC packaging industry is now being driven by mobile devices, a market where cost and size are key. Going to finer line widths and spacings allows a reduction in the number of layers making up a multilayer chip package, giving a reduction in the cost and height profile of the device, as well as improved signal latency. Embedding conductors within a dielectric film makes it possible to plate to the required thickness without lateral growth of the traces. Using an ablative laser process to dodoi:10.2961/jlmn.2015.01.0019 fatcat:hdnkfotutrg73jpyntyjjpnffa