Conformal Copper Coating of True Three-Dimensional Through-Holes Using Supercritical Carbon Dioxide

Mitsuhiro Watanabe, Yuto Takeuchi, Takahiro Ueno, Masahiro Matsubara, Eiichi Kondoh, Satoshi Yamamoto, Naohiro Kikukawa, Tatsuo Suemasu
2012 Japanese Journal of Applied Physics  
Copper thin films were deposited inside true three-dimensional, high aspect ratio, and complex shaped through-holes that were formed in glass substrates. The deposition was carried out in a supercritical carbon dioxide solution from a copper complex via hydrogen reduction. The conformal thin films were successfully deposited on the sidewalls of straight, crank-shaped, and Y-shaped through-holes. The coating length increased with decreasing the deposition temperature. Numerical simulations
more » ... l simulations suggested an importance of the presence of a fluid motion in the through-holes.
doi:10.1143/jjap.51.05ea01 fatcat:7ug5rf77mng5daqjuav3exhm2y