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Morphologies and Properties of Cured Epoxy/Phenoxy Containing Carboxyl Groups Blends as Adhesives for Flexible Printed Circuits(FPCs)
FPC接着剤用エポキシ樹脂/カルボキシル基含有フェノキシ樹脂混合硬化物のモルフォロジーと特性

Naoki YOKOYAMA, Osamu AMESAWA, Katsunori SEKIYA, Katsuyuki AIDA, Shigeaki TAUCHI
2011 Journal of The Adhesion Society of Japan  

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doi:10.11618/adhesion.47.478 fatcat:2ij2nejjcjcdxigxaw7b26x33q
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Naoki YOKOYAMA, Osamu AMESAWA, Katsunori SEKIYA, Katsuyuki AIDA, Shigeaki TAUCHI. "Morphologies and Properties of Cured Epoxy/Phenoxy Containing Carboxyl Groups Blends as Adhesives for Flexible Printed Circuits(FPCs)." Journal of The Adhesion Society of Japan 47.12 (2011) 478-484