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Defect Filling Method of Sensor Encapsulation Based on Micro-Nano Composite Structure with Parylene Coating
The demand for waterproofing of polymer (parylene) coating encapsulation has increased in a wide variety of applications, especially in the waterproof protection of electronic devices. However, parylene coatings often produce pinholes and cracks, which will reduce the waterproof effect as a protective barrier. This characteristic has a more significant influence on sensors and actuators with movable parts. Thus, a defect filling method of micro-nano composite structure is proposed to improvedoi:10.3390/s21041107 pmid:33562626 fatcat:wsnapkbgzzawfgqnx2ukbb6igi