In this research, the thermal behavior of a vapor chamber embedded in the base of a heat sink was experimentally analyzed considering the influence of the heat source position. The vapor chamber was produced by a copper and molybdenum alloy with length of 240 mm, width of 54 mm, thickness of 3 mm, and capillary structures composed by copper screen meshes. The working fluid used was de-ionized water. The pure aluminum heat sink was cooled by air forced convection and the evaporator vapor chamber

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... was heated using an electrical resistor simulating integrated circuit power dissipation. The experimental tests were done in a suction type wind tunnel with open return for a heat load varying from 20 to 80 W, for an airflow velocity varying from 1 to 4 m/s, and for three different heat source positions. The experimental results showed that, independently of the heat source position, the considered vapor chamber worked successfully, maintaining low operating temperature.