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ISLPED '05. Proceedings of the 2005 International Symposium on Low Power Electronics and Design, 2005.
Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is affected by both the power consumption of processor components and the chip layout. Therefore, for thermal-aware design it is crucial to consider the thermal effects of different floorplans during micro-architectural design space exploration. In this paper, we propose a thermal-aware architectural floorplanning framework. With the aid of this framework, an architect can explore both physical anddoi:10.1109/lpe.2005.195500 fatcat:jqtmk57slzfyxndombhqcp6to4