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The design implications of two distinct through silicon via (TSV) fabrication methods (via-first and via-last) have been investigated for power delivery in a 3D system. Different geometry, connectivity, and filling materials have been considered to develop equivalent electrical models for both via-first and via-last based power distribution networks. Based on these models, a valid design space has been developed where power supply noise is satisfied and physical area overhead is minimized.doi:10.1145/2483028.2483111 dblp:conf/glvlsi/SatheeshS13 fatcat:4gktwndt3jdyxdgcw3d6tuhjvm