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3D-ICE 3.0: efficient nonlinear MPSoC thermal simulation with pluggable heat sink models
2021
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
The increasing power density in modern highperformance multi-processor system-on-chip (MPSoC) is fueling a revolution in thermal management. On the one hand, thermal phenomena are becoming a critical concern, making accurate and efficient simulation a necessity. On the other hand, a variety of physically heterogeneous solutions are coming into play: liquid, evaporative, thermoelectric cooling, and more. A new generation of simulators, with unprecedented flexibility, is thus required. In this
doi:10.1109/tcad.2021.3074613
fatcat:fm6p7hom2nejjdh4r4t3xcks3m