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Development of Die-Bonding Film for Semiconductor Packages Applied Reaction-Induced Phase Separation
反応誘起型相分離材料を用いたダイボンディングフィルムの開発並びに実用化

Teiichi INADA, Keiichi HATAKEYAMA, Tetsuro IWAKURA, Kazunori YAMAMOTO, Michio URUNO, Takayuki MATSUZAKI, Michio MASHINO, Youichi HOSOKAWA
2008 Journal of The Japan Institute of Electronics Packaging  

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Low-modulus die-bonding films are useful for stacked multi-chip packages which are suitable for
doi:10.5104/jiep.11.484 fatcat:klnrvypi4jaxrjhpiwosdiy6ue
Citation

Teiichi INADA, Keiichi HATAKEYAMA, Tetsuro IWAKURA, Kazunori YAMAMOTO, Michio URUNO, Takayuki MATSUZAKI, Michio MASHINO, Youichi HOSOKAWA. "Development of Die-Bonding Film for Semiconductor Packages Applied Reaction-Induced Phase Separation." Journal of The Japan Institute of Electronics Packaging 11.7 (2008) 484-490