Precision laser slicing technology for single-crystal SiC wafer
SiCの精密レーザスライシング

Yohei YAMADA, Tomohiro IKEDA, Junichi IKENO
Journal of the Japan Society for Abrasive Technology  
doi:10.11420/jsat.64.635 fatcat:zbvkb4fm3fe2bclecczg6hme5a