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This article gives an overview of fabrication and performance of a class of vacuum microelectronic devices, namely, silicon tip-on-post field emitter arrays ͑FEAs͒. Experimental data illustrating the device performance are presented in the context of requirements for field emission flat panel display and microwave power amplifier applications. Critical geometrical parameters of the device are discussed, and a fabrication process flow designed to optimize these parameters is described. Equipmentdoi:10.1116/1.581207 fatcat:rbie5ehkkvbi7mhv43umqx6354