Impact induced delamination detection and quantification with guided wavefield analysis

Zhenhua Tian, Cara A. C. Leckey, Lingyu Yu, Jeffrey P. Seebo, Jerome P. Lynch
2015 Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2015  
This paper studies impact induced delamination detection and quantification methods via guided wavefield data and spatial wavenumber imaging. In this study, the complex geometry impact-like delamination damage in a composite laminate is created through the quasi-static indention technique. To detect and quantify the delamination damage, the guided ultrasonic waves are excited through a piezoelectric actuator, and the guided wavefields are measured by a scanning laser Doppler vibrometer. The
more » ... vibrometer. The acquired guided wavefield data represent wave propagation in the composite plate and includes complex wave interaction at the delamination region. To process the wavefield data and evaluate the delamination damage, the measured wavefields are analyzed through the spatial wavenumber imaging method which can generate an image containing the dominant local wavenumber at each spatial location. For a proof of concept, the approach is first applied to a single Teflon insert simulating a delamination, and then to the complex geometry impactlike delamination damage. The results show that the spatial wavenumber imaging can not only determine the delamination location, but also provide quantitative information regarding the delamination size and shape. The detection results for the impact induced delamination are compared to an ultrasonic C-scan image and wavenumber images are studied for two different excitation frequencies. Fairly good agreement is observed for portions of the delamination, and differences in wavenumber are observed at the two different frequencies. Results demonstrate that the spatial wavenumber imaging is a promising technique for yielding delamination location and size information.
doi:10.1117/12.2083358 fatcat:qhrct5lumnh6dhfghrcf3eewvm