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2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
As power densities in electronic devices have increased dramatically over the last decade, advanced thermal management solutions are required. A significant part of the thermal resistance budget is commonly taken up by the heat spreader, which serves to reduce the input heat flux and connect to an increased area for heat removal. Thermal ground planes are devices that address this issue by utilizing two-phase heat transfer achieving higher effective thermal conductivities than conventionaldoi:10.1109/itherm.2010.5501325 fatcat:f4l4fqlljrdd7gb47hym72tudi