A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2015; you can also visit the original URL.
The file type is application/pdf
.
Assessing Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
2007
2007 Design, Automation & Test in Europe Conference & Exhibition
Field Programmable Gate Arrays (FPGAs) are important hardware platforms in various applications due to increasing design complexity and mask costs. However, as CMOS process technology continues to scale, standard copper interconnect will become a major bottleneck for FPGA performance. In this paper, we propose utilizing bundles of single-walled carbon nanotubes (SWCNT) as wires in the FPGA interconnect fabric and compare their performance to standard copper interconnect in future process
doi:10.1109/date.2007.364609
dblp:conf/date/EachempatiNGVM07
fatcat:y6k2lzwkabbr3jr7oqblo4p5gm