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Field Programmable Gate Arrays (FPGAs) are important hardware platforms in various applications due to increasing design complexity and mask costs. However, as CMOS process technology continues to scale, standard copper interconnect will become a major bottleneck for FPGA performance. In this paper, we propose utilizing bundles of single-walled carbon nanotubes (SWCNT) as wires in the FPGA interconnect fabric and compare their performance to standard copper interconnect in future processdoi:10.1109/date.2007.364609 dblp:conf/date/EachempatiNGVM07 fatcat:y6k2lzwkabbr3jr7oqblo4p5gm