Effects of Slurry Particles on Silicon Dioxide CMP

Wonseop Choi, Jeremiah Abiade, Seung-Mahn Lee, Rajiv K. Singh
2004 Journal of the Electrochemical Society  
The performance of chemical mechanical polishing ͑CMP͒ is determined by the dynamic contact behavior ͑sliding or rolling͒ of the slurry particles during polishing. The dynamic contact behavior of slurry particles is dependent on the shape, size, and concentration of particles. In this paper, the dynamic contact characteristics and their effects on the CMP performance were investigated through in situ friction force measurements, atomic force microscopy images, and polishing experiments. For
more » ... xperiments. For slidingdominated contact, the friction force remains unchanged within the specified testing period yielding scratch-type surface topography. For rolling-dominated contact, the friction force decreases with time under a constant solids loading, producing "shot-blast" surface images. The polishing rate increases with solids loading of sliding particles and decreases with solids loading of rolling particles. Further optimization of the CMP process is possible by tailoring the dynamic contact of abrasive particles.
doi:10.1149/1.1768133 fatcat:s5rkfzvld5c7ljetrhtatxkjeu