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The performance of chemical mechanical polishing ͑CMP͒ is determined by the dynamic contact behavior ͑sliding or rolling͒ of the slurry particles during polishing. The dynamic contact behavior of slurry particles is dependent on the shape, size, and concentration of particles. In this paper, the dynamic contact characteristics and their effects on the CMP performance were investigated through in situ friction force measurements, atomic force microscopy images, and polishing experiments. Fordoi:10.1149/1.1768133 fatcat:s5rkfzvld5c7ljetrhtatxkjeu