A time-domain surface integral technique for mixed electromagnetic and circuit simulation

Chuanyi Yang, V. Jandhyala
2005 IEEE Transactions on Advanced Packaging  
This paper presents a coupled simulation approach in the time domain for modeling non-linear circuits, electromagnetic components, and EMI interactions together in one integrated methodology. The approach is based on a rigorous coupling of circuit simulation and time domain integral equation simulation. The method obviates the need for circuit realizations of electromagnetic interactions, and can be considered complementary to the partial element equivalent circuits, for cases where
more » ... d modeling is preferable such as complex connectors and packages, and for Green's function based modeling of skin effects. 1.Introduction Time domain electromagnetic solvers are useful for simulating coupled circuitelectromagnetic (EM) problems involving integrated circuit packages and systems-onchip, wherein effects of nonlinearities of circuit elements can be modeled accurately [1]. The surface-based time domain integral equation (TDIE) approach has been gaining in popularity owing to its flexibility in modeling arbitrarily-shaped structures and its enhanced computational performance due to advances in fast solution methods [2].
doi:10.1109/tadvp.2005.848389 fatcat:4hpuzj2wjfgblgcifmd7u7nfqq