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A time-domain surface integral technique for mixed electromagnetic and circuit simulation
2005
IEEE Transactions on Advanced Packaging
This paper presents a coupled simulation approach in the time domain for modeling non-linear circuits, electromagnetic components, and EMI interactions together in one integrated methodology. The approach is based on a rigorous coupling of circuit simulation and time domain integral equation simulation. The method obviates the need for circuit realizations of electromagnetic interactions, and can be considered complementary to the partial element equivalent circuits, for cases where
doi:10.1109/tadvp.2005.848389
fatcat:4hpuzj2wjfgblgcifmd7u7nfqq