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Low-Cycle-Fatigue Failures of Solder Material in Electronics Packaging: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review
2018
Journal of Aerospace Engineering and Mechanics
This review paper is based mostly on the author's recent publications and addresses the application of analytical ("mathematical") predictive modeling to understand the physics and mechanics of the behavior and performance of solder materials and solder joint interconnections employed in IC devices. The emphasis is on the design for reliability and, first of all, on the prediction of the thermal stresses and strains in solder joint interconnections in electronic products. While the majority of
doi:10.36959/422/433
fatcat:l7k3uzrhobaxbksebcwvtvn4ly