Low-Cycle-Fatigue Failures of Solder Material in Electronics Packaging: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review

Suhir E
2018 Journal of Aerospace Engineering and Mechanics  
This review paper is based mostly on the author's recent publications and addresses the application of analytical ("mathematical") predictive modeling to understand the physics and mechanics of the behavior and performance of solder materials and solder joint interconnections employed in IC devices. The emphasis is on the design for reliability and, first of all, on the prediction of the thermal stresses and strains in solder joint interconnections in electronic products. While the majority of
more » ... he numerous studies addressing solder materials are either experimental or based on finite-element-analyses (FEA), the approach considered in this review uses analytical predictive modeling techniques to predict stresses in solder interconnections and suggest methods for stress minimization. The developed models enable to come up with the most effective design-for-reliability methodologies to relieve the induced stresses and strains in solder joints of both levels of interconnections, and to predict, at the design stage, if inelastic strains in the solder material could be avoided. If not, these models are able to establish the sizes of the inelastic zones at the end portions of the soldered assemblies. It is concluded that all the three approaches of the applied science and engineering -experimental, computer-aided and analytical -are equally important from the standpoint of making a viable electron device into a reliable product, and that this review can explain how analytical modeling can be used in predicting and possibly preventing failures of solder joints in electronic products.
doi:10.36959/422/433 fatcat:l7k3uzrhobaxbksebcwvtvn4ly