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Inherently two factors namely multi-material usage and potential bias makes electronic devices susceptible to corrosion if exposed to humid conditions. The problem is compounded today due to miniaturization and contamination effects. The reduction in size of the components and close spacing on a Printed Circuit Board (PCB) for high density packing has greatly increased the risk of corrosion under humid conditions. An important issue is the failures due to electrolytic metal migration. Thisdoi:10.1149/1.2900650 fatcat:vkwowdukajclhpfq5xrd2aa37i