Microstructural and Nanoindentation Studies Across Diffusion-bonded Interfaces in Al/Cu Metal Intermetallic Laminates

S.S.M. Kartheek, K.V. Vamsi, B. Ravisankar, K. Sivaprasad, S. Karthikeyan
2014 Procedia Materials Science  
In this study, alternate layers of Al and Cu were diffusion bonded to obtain a Metal Intermetallic Laminate (MIL). Intermetallic compounds form at the Al/Cu interface due to in-situ reactions between the metals. The type of compounds formed, their individual mechanical properties and the strength of the interface play a central role in determining the mechanical response of these laminates. In this context, we have characterized the Al/Cu interface and the interfacial intermetallics by means of
more » ... tallics by means of SEMbased microstructural studies, X-ray diffraction and cross-sectional nanoindentation studies. Microstructural characterization, composition profiles and X-ray diffraction reveal the formation of three intermetallic phases at the interface. Furthermore, nanoindentation studies suggest that the intermetallic phases are not only stiff and hard, but are also well-bound to the abutting metal layers. This suggests the possibility of enhanced mechanical properties for the laminate.
doi:10.1016/j.mspro.2014.07.087 fatcat:i4guebq3x5chppart4di7id2rm