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New methods to assemble, integrate, and package micro devices are always needed in attempts to simplify and expedite fabrication methods to maximize throughput. Our paper focuses on assessing SU-8 as a viable material for packaging and flip chip bonding processes for MEMS and micro devices. In this paper, we vary the level of crosslinking through post exposure bake (PEB) times and assess rectangular ring test structures bonding strength following flip chip bonding through applied tensile loads.doi:10.1016/j.proeng.2011.12.117 fatcat:7olbkiq6q5fbvpttbjow2ctfci