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Welcome Message from Shen-Li Fu, Conference General Chair
2021
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Dear Colleagues and Friends, On behalf of the Organizing Committee, I'd like ot welcome all of you to the 16 th International Microsystems Packaging Assembly and Circuits Technology Conference "IMPACT 2021 Conference" . All the participants will be benefited from various sessions organized by the Technical Program Committee and the organizers including ITRI, IEEE EPS-Taipei, IMAPS-Taiwan , and TPCA . For grasping the latest trend, the symposium this year highlights the theme "IMPACT on 5G+" .
doi:10.1109/impact53160.2021.9696934
fatcat:gimpsaxtr5awndgzmlmcsmfivq