The Structure and Properties of Reactively Bonded Thick Film Gold Conductors

M. V. Coleman, G. E. Gurnett
1978 ElectroComponent Science and Technology  
The properties of reactively bonded gold conductors have been compared with a fritted gold conductor (DuPont 9260). Several different additives in the gold conductors were examined, including copper/copper oxide; copper plus cadium/germanium and copper cadium and bismuth.The adhesion strength of all the conductors was found to be superior to the fritted standard, but the electrical conductivity did not appear to be improved. These materials thus offer advantages where stronger adhesion is
more » ... ed or possibly, where the interface between conductor and substrate needs to be well-defined.
doi:10.1155/apec.5.55 fatcat:dukeux7iwjbvnfstfpphg7xwwy