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In this paper, we perform an exploration of 3D NoC architectures through physical design implementation based on two tiers Tezzaron 3D technology. The 3D NoC partitioning is done by dividing the NoC's datapath component into two blocks placed in the two tiers. Two Stacked NoC architectures namely Stacked 3D-Mesh NoC and Stacked 2D-Hexagonal NoC developed based on this partitioning strategy are analyzed by comparing their performances with Stacked 2D-Mesh NoC and classical 2D-Mesh and 3D-Meshdoi:10.1109/dsd.2013.135 dblp:conf/dsd/JabbarHH13 fatcat:tdyicb5ggneole7c6aeeinjanm