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Electrochemical migration of Sn and Ag in NaCl environment
2016
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)
The impact of chloride ion concentration on electrochemical migration (ECM) of tin and silver was studied by using an in-situ optical and electrical inspection system. It was found, that in both cases, dendrites grow not only in an electrolyte solution at low chloride concentration but also in an electrolyte at medium and high or even saturated chloride concentrations as well. According to the results, the migration susceptibility has decreased at low and medium concentration levels in both
doi:10.1109/siitme.2016.7777294
fatcat:bsr5a665pfb2tnlbflmpylegze