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A Comparative Study of VLSI 3D Placement for power management and wirelength reduction
2018
International Journal of Engineering Research and
In recent days every application must need power management and area management such physical problems and aspects of VLSI design. Minimization of power and area are highly complex integrated systems in microelectronics have led to the 3 Dimension developments a technological approach. 3 Dimension offers numerous advantages: Size, power consumption, hybrid integration etc., various techniques to handle the power management in IC. Power dissipation in a IC is base on power used by the IC and
doi:10.17577/ijertcon052
fatcat:y4qeppfoqzhephtkwt66dqlzue