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In this paper, we present the dependence of source resistance sensibility on the gate bias effect in a High Electron Mobility Transistor (HEMT) using the Drift-Diffus (D-D) model with the SILVACO Technology Computer-Aided Design (TCAD) tool. The obtained results show that the increases of gate bias effect on substrate lead to decreasing the source resistance of the simulated device. The reported increase in the effect of gate induces the increases of transferred holes concentration towards thedoi:10.15598/aeee.v19i4.3820 fatcat:vafdshpkmvdkfdxnhkhhjyyk5y