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Substrate Transfer Technology for Stretchable Electronics
2016
Procedia Engineering
This paper focuses on the implementation of a new technique for the fabrication of stretchable electronic patches that can be used for medical applications. The technique is based on the Electronics on Plastics by Laser Release (EPlaR) technology which enables a one-step release of a stack of flexible/stretchable layers incorporating the active layers like interconnects and embedded devices. As a proof of concept meander shaped polyimide (PI) structures are fabricated on top of a glass
doi:10.1016/j.proeng.2016.11.459
fatcat:bitqy3j4wjazjiipinp3knxvqy