DIFFUSION MECHANISMS IN THE Cu/Sb THIN FILM SYSTEM

R. HALIMI, A. MERABET
1990 Le Journal de Physique Colloques  
The i n t e r d i f f u s i o n o f b i m e t a l l i c Cu/Sb t h i n f i l m couples is s t u d i e d u s i n g Rutherford b a c k s c a t t e r i n g f o r a n n e a l i n g temperatures i n t h e range 150 -300°C. Depth p r o f i l e s a r e analyzed u s i n g t h e Whipple's model. Taking t h e l a t t i c e d i f f u s i v i t i e s o f Sb i n Cu from Ref./l2/, following a c t i v a t i o n e n e r i e s f o r g r a i n boundary d i f f u s i o n a r e found : 1 , l 2 eV and 1 , 2 6 eV f o
more » ... and 1 , 2 6 eV f o r r e s p e c t i v e l y (600 1 Sb on 650 d Cu) and (1800 d Sb on 3100 1 Cu) samples. I t is e s t a b l i s h e d t h a t t h e g r a i n boundary d i f f u s i v i t i e s a r e 3 -6 times l a r g e r t h a n t h e l a t t i c e d i f f u s i v i t i e s p r e d i c t e d by an e x t r a p o l a t i o n o f r a d i o a c t ive t r a c e r measurements of bulk specimens. I t i s a l s o observed t h a t d i f f u s i o n is lower i n r e l a t i v e l y t h i c k samples.
doi:10.1051/jphyscol:1990178 fatcat:44wb3hcz2zaavmnbax6de237aa