Electrically Loaded Adhesive Bonds Formed on Different Surfaces

Pavel Mach, Radoslav Radev
2007 2007 30th International Spring Seminar on Electronics Technology (ISSE)  
Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces -Cu, immerse Au and Sn (HAL). Epoxy resin types ofadhesives with Agflakes have been used. The bonds have been fabricated by assembly ofjumpers. Two types of electrical load have been applied. DC current JA and rectangular current pulses with the frequency of 500 Hz, mark-space ratio 1.] and amplitude of JA. The resistances, nonlinearity and noise of the
more » ... and noise of the bonds have been measured. It has been found that quality of the bonds on Sn surface finish is unacceptable through instability and level of measured parameters. The resistances and nonlinearity of the bonds formed on Au surface finish have beenhigher in comparison with those measured on Cu pads, noise have been comparable. Both types ofthe current load have caused low changes ofall parameters tested.
doi:10.1109/isse.2007.4432881 fatcat:ofutgaxutjcbtfkrujzmsdqb5a