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Optical and Auger Microanalyses of Solder Adhesion Failures in Printed Circuit Boards
1981
Journal of the Electrochemical Society
Printed circuit boards used in electrical systems have shown solder separation from the copper wiring network with prolonged use at about 325 K (120~176 Optical and Auger microanalyses of boards that have shown such failures have revealed the existence of discrete oxide particles in the form of an oxide layer at the separated interface. High temperature accelerated aging tests have shown that the time-dependent accumulation of the oxide particles at this interface results from rejection of the
doi:10.1149/1.2127425
fatcat:fkrdqhta3zalfcuup6d4hc2ph4