Reliability Problems of Micro-Electronic Encapsulations

I. Titu-Marius BĂJENESCU
2021 Electrotehnică, electronică, automatică  
Smaller, lighter, faster, cheaper are today demands; new technologies stack and interconnect materials and components are utilised to achieve high density, small size, low weight, reduced power, and very low cost. Particularly important in this context is the implementation of higher densities, reduced volume hand in hand with improved reliability. A good price-performance ratio is key.
doi:10.46904/eea.21.69.1.1108009 fatcat:gvitudk6hjfapg6hj42tqsoyui