Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

Myung-Jin Yim, Jin-Sang Hwang, Jin-Gu Kim, Hyoung-Joon Kim, Woonseong Kwon, Kyung Woon Jang, Kyung Wook Paik
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)  
hi this paper, we present the development work of anisotropic conductive adhesives with particular emphasis on the enhanced thermal conductivity of ACAs for flip chip application. To ensure good thermal conductivity, we incorporated silicon carbide (Sic) fillers in the ACA formulation. Silicon carbide is used in formulation as functional fillers due to its excellent thermal conductivity and electrical nonconductivity. The effect of Sic fillers on the thermal conductivity, thermo-mechanical
more » ... rties of modified ACA materials and the reliability of flip chip assembly on organic subslrates using ACAs with enhanced thermal conductivity was investigated. Loading thermally conductive and electrically non-conductive fillers with smaller size than conductive fillers didn't affect the electrical anisotropic property of ACA joints, but improved thermal transmittance and other mechanical properties such as CTE of ACA between chip and substrate. For the characterization of modified ACAs with enhanced thermal conductivity by loading different content of Sic fillers, measurement of thermal conductivity and thermomechanical analyses such as dynamic scanning calorimeter (DSC), dynamic mechanical analysis (DMA), and thermomechanical analysis (TMA) were performed. The current carrying capability and reliability of flip chip joint using conventional ACA and novel ACA with enhanced thermal conductivity were compared to investigate the role of ACA. as new thermal transfer medium in the flip chip assembly. We developed new ACA with high thermal conductivity which can bring wide use of adhesive flip chip technology with improved reliability under high current stressing. This paper is part of a broad study of thermally conductive ACAs for flip chip package and other electronic packaging technology.
doi:10.1109/ectc.2004.1319330 fatcat:la3alachxvgxndk2vq7qyo2qo4