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Reversal imprinting by transferring polymer from mold to substrate
2002
Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena
A reversal imprinting technique was developed in this study. A polymer layer was first spin coated on a patterned hard mold, and then transferred to a substrate under an elevated temperature and pressure. The reversal imprinting method offers an advantage over conventional nanoimprinting by allowing imprinting onto substrates that cannot be easily spin coated, such as flexible polymer substrates. Another unique feature of reversal imprinting is that three different pattern-transfer modes can be
doi:10.1116/1.1523404
fatcat:nv5yakajzvdujkovekaigoqnw4