This paper proposes the replacement of a conventional Insulating-Metal-Substrate (IMS) dielectric layer with an electroconductive adhesive which is applied onto a treated aluminium heat sink. The adhesive based structure results in a lower thermal resistance of the system compared to IMS based on Aluminium. The model covers the investigation of two IMS structure with a Copper conductor layer with a thickness of 200µm, a dielectric layer of 50µm with different thermal conductivities and an

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... ium base layer with a thickness of 920µm. However, the IMS is placed onto a 100 x 100 x 33 mm Aluminium heat sink. The investigated adhesive based structure consists of the same Aluminium heat sink treated with an oxidation layer with a thickness of 50µm and an adhesive conductor layer with 30µm thickness. Furthermore, the use of forced convection to reduce the junction temperature of all three models is also considered.