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Electrothermal engineering in the nanometer era
2006
Proceedings of the 2006 conference on Asia South Pacific design automation - ASP-DAC '06
Management of electrothermal (ET) issues arising due to power dissipation both at the micro-and macro-scale is central to the development of future generation microprocessors, integrated networks, and other highly integrated circuits and systems. This paper will provide a broad overview of various ET effects in nanoscale VLSI and highlight both technology and design choices that are thermally-aware. First, effects at the micro scale--in interconnects and devices and their implications for
doi:10.1145/1118299.1118360
fatcat:62pp7iver5dudjt4i54tkrehlu