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A distributed embedded system consists of different processing elements (PEs) communicating via communication links. PEs have various power characteristics and in turn, have different thermal profiles. With new technologies, processor power density is dramatically increased which results in high temperature. This alarming trend underscores the importance of temperature management methods in system design. The majority of proposed techniques to address thermal issues, impose severe penalties ondoi:10.1109/euc.2010.11 dblp:conf/euc/GhahfarokhiE10 fatcat:jzxpiuqdbjalzmrpw5sk7xjpy4