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UNDER BUMP METALLISATION OF FINE PITCH FLIP-CHIP USING ELECTROLESS NICKEL DEPOSITION
2000
Journal of electronics manufacturing
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the solder during reflow. The requirements of the UBM are therefore to provide a solder wettable surface
doi:10.1142/s0960313100000198
fatcat:3nowyph7gncbxfr4yrhz6ox6ky