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Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
2019
Journal of Welding and Joining
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Transient Liquid Phase Bonding (TLPB) is one of the promising processes for interconnecting power semiconductors, which are usually used at high temperature. However, the TLPB process parameters needed to ensure robust interconnection have not been systematically studied. In this study, TLPB was conducted with various bonding temperatures and times. Sandwich structures made of Cu/Sn/Cu, Ag/Sn/Ag, and Ni/Sn/Ni were processed at 250 and 280 ℃ for 1, 2, and 3 h, respectively. The microstructure of
doi:10.5781/jwj.2019.37.4.11
fatcat:lcuuc4zojzgrfc2h5dqbwwzr2q